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Multi-wafer virtual probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation

Publication ,  Conference
Zhang, W; Li, X; Acar, E; Liu, F; Rutenbar, R
Published in: IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
January 1, 2010

In this paper, we propose a new technique, referred to as MultiWafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Towards this goal, a novel Bayesian inference is derived to extract a shared model template to explore the wafer-to-wafer correlation information within the same lot. In addition, a robust regression algorithm is proposed to automatically detect and remove outliers (i.e., abnormal measurement data with large error) so that they do not bias the modeling results. The proposed MVP method is extensively tested for silicon measurement data collected from 200 wafers at an advanced technology node. Our experimental results demonstrate that MVP offers superior accuracy over other traditional approaches such as VP [7] and EM [8], if a limited number of measurement data are available. ©2010 IEEE.

Duke Scholars

Published In

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

DOI

ISSN

1092-3152

ISBN

9781424481927

Publication Date

January 1, 2010

Start / End Page

47 / 54
 

Citation

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Zhang, W., Li, X., Acar, E., Liu, F., & Rutenbar, R. (2010). Multi-wafer virtual probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation. In IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD (pp. 47–54). https://doi.org/10.1109/ICCAD.2010.5654349
Zhang, W., X. Li, E. Acar, F. Liu, and R. Rutenbar. “Multi-wafer virtual probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation.” In IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, 47–54, 2010. https://doi.org/10.1109/ICCAD.2010.5654349.
Zhang W, Li X, Acar E, Liu F, Rutenbar R. Multi-wafer virtual probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation. In: IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. 2010. p. 47–54.
Zhang, W., et al. “Multi-wafer virtual probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation.” IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, 2010, pp. 47–54. Scopus, doi:10.1109/ICCAD.2010.5654349.
Zhang W, Li X, Acar E, Liu F, Rutenbar R. Multi-wafer virtual probe: Minimum-cost variation characterization by exploring wafer-to-wafer correlation. IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD. 2010. p. 47–54.

Published In

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

DOI

ISSN

1092-3152

ISBN

9781424481927

Publication Date

January 1, 2010

Start / End Page

47 / 54