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Two-dimensional array transducers using thick film connection technology.

Publication ,  Journal Article
Smith, SW; Light, ED
Published in: IEEE transactions on ultrasonics, ferroelectrics, and frequency control
January 1993

A connection technique for two-dimensional array ultrasound transducers developed by combining a conductive lambda/4 mismatching layer with a multi-layer ceramic (MLC) connector using thick-film microelectronic technology is described. The connector consists of 20 thick films of alumina and screen printed metallization with customized interconnections between the layers called vias. Ten ground layers are interleaved between ten signal layers to reduce elecrical crosstalk. A lambda/4 mismatching layer of conductive epoxy is bonded between each PZT element and the silver metal pad of the MLC connector to provide an effective low impedance backing. In the current configuration, a 16x16 transducer array, 0.6 mm element spacing, is expanded to a 16x16 grid of connector pins at a standard spacing of 2.5 mm. Vector impedance, sensitivity, bandwidth, interelement uniformity, and crosstalk are all in good agreement with arrays of conventional fabrication. However, an array with MLC connector can be fabricated more quickly independent of the number of elements.

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Published In

IEEE transactions on ultrasonics, ferroelectrics, and frequency control

DOI

EISSN

1525-8955

ISSN

0885-3010

Publication Date

January 1993

Volume

40

Issue

6

Start / End Page

727 / 734

Related Subject Headings

  • Acoustics
  • 51 Physical sciences
  • 40 Engineering
  • 09 Engineering
  • 02 Physical Sciences
 

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Smith, S. W., & Light, E. D. (1993). Two-dimensional array transducers using thick film connection technology. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 40(6), 727–734. https://doi.org/10.1109/58.248217
Smith, S. W., and E. D. Light. “Two-dimensional array transducers using thick film connection technology.IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 40, no. 6 (January 1993): 727–34. https://doi.org/10.1109/58.248217.
Smith SW, Light ED. Two-dimensional array transducers using thick film connection technology. IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 1993 Jan;40(6):727–34.
Smith, S. W., and E. D. Light. “Two-dimensional array transducers using thick film connection technology.IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 40, no. 6, Jan. 1993, pp. 727–34. Epmc, doi:10.1109/58.248217.
Smith SW, Light ED. Two-dimensional array transducers using thick film connection technology. IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 1993 Jan;40(6):727–734.

Published In

IEEE transactions on ultrasonics, ferroelectrics, and frequency control

DOI

EISSN

1525-8955

ISSN

0885-3010

Publication Date

January 1993

Volume

40

Issue

6

Start / End Page

727 / 734

Related Subject Headings

  • Acoustics
  • 51 Physical sciences
  • 40 Engineering
  • 09 Engineering
  • 02 Physical Sciences