C-V measurement and simulation of silicon-insulator-silicon (SIS) structures for analyzing charges in buried oxides of bonded SOI materials
Publication
, Journal Article
Mitani, K; Massoud, HZ
Published in: IEICE Trans. Electron. (Japan)
1992
Charges in buried oxide layers formed by wafer bonding were evaluated by capacitance-voltage (C-V) measurements. In this study, silicon-insulator-silicon (SIS) and metal-oxide-silicon (MOS) capacitors were fabricated on bonded wafers. For analyzing C-V curves of SIS structures, C-V simulation programs were developed. From the analysis, the authors concludes that approximately 2×1011/cm2 negative charges were distributed uniformly in the oxide. The effect of the experimental conditions during wafer bonding on generated charges in buried oxides is also discussed
Duke Scholars
Published In
IEICE Trans. Electron. (Japan)
Publication Date
1992
Volume
E75-C
Issue
12
Start / End Page
1421 / 1429
Citation
APA
Chicago
ICMJE
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Mitani, K., & Massoud, H. Z. (1992). C-V measurement and simulation of silicon-insulator-silicon (SIS) structures for analyzing charges in buried oxides of bonded SOI materials. IEICE Trans. Electron. (Japan), E75-C(12), 1421–1429.
Mitani, K., and H. Z. Massoud. “C-V measurement and simulation of silicon-insulator-silicon (SIS) structures for analyzing charges in buried oxides of bonded SOI materials.” IEICE Trans. Electron. (Japan) E75-C, no. 12 (1992): 1421–29.
Mitani K, Massoud HZ. C-V measurement and simulation of silicon-insulator-silicon (SIS) structures for analyzing charges in buried oxides of bonded SOI materials. IEICE Trans Electron (Japan). 1992;E75-C(12):1421–9.
Mitani, K., and H. Z. Massoud. “C-V measurement and simulation of silicon-insulator-silicon (SIS) structures for analyzing charges in buried oxides of bonded SOI materials.” IEICE Trans. Electron. (Japan), vol. E75-C, no. 12, 1992, pp. 1421–29.
Mitani K, Massoud HZ. C-V measurement and simulation of silicon-insulator-silicon (SIS) structures for analyzing charges in buried oxides of bonded SOI materials. IEICE Trans Electron (Japan). 1992;E75-C(12):1421–1429.
Published In
IEICE Trans. Electron. (Japan)
Publication Date
1992
Volume
E75-C
Issue
12
Start / End Page
1421 / 1429