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Strain-modulated epitaxy: A flexible approach to 3-D band structure engineering without surface patterning

Publication ,  Journal Article
Carter-Coman, C; Brown, AS; Bicknell-Tassius, R; Jokerst, NM; Allen, M
Published in: Applied Physics Letters
July 8, 1996

Thin compliant growth substrates have been used to reduce the strain in lattice-mismatched overlayers during epitaxial growth. This letter reports a new thin compliant substrate technology which allows these thin substrates to be patterned on the bottom, bonded surface. This lateral strain variation (inverted stressor) in the growing film can be combined with the additional effects of strain-dependent growth kinetics to realize the lateral control of composition and thickness without any surface topography on the substrate. Initial demonstrations of the growth of InGaAs on GaAs bottom-patterned thin substrates are presented herein. © 1996 American Institute of Physics.

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Published In

Applied Physics Letters

DOI

ISSN

0003-6951

Publication Date

July 8, 1996

Volume

69

Issue

2

Start / End Page

257 / 259

Related Subject Headings

  • Applied Physics
  • 51 Physical sciences
  • 40 Engineering
  • 10 Technology
  • 09 Engineering
  • 02 Physical Sciences
 

Citation

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Carter-Coman, C., Brown, A. S., Bicknell-Tassius, R., Jokerst, N. M., & Allen, M. (1996). Strain-modulated epitaxy: A flexible approach to 3-D band structure engineering without surface patterning. Applied Physics Letters, 69(2), 257–259. https://doi.org/10.1063/1.117942
Carter-Coman, C., A. S. Brown, R. Bicknell-Tassius, N. M. Jokerst, and M. Allen. “Strain-modulated epitaxy: A flexible approach to 3-D band structure engineering without surface patterning.” Applied Physics Letters 69, no. 2 (July 8, 1996): 257–59. https://doi.org/10.1063/1.117942.
Carter-Coman C, Brown AS, Bicknell-Tassius R, Jokerst NM, Allen M. Strain-modulated epitaxy: A flexible approach to 3-D band structure engineering without surface patterning. Applied Physics Letters. 1996 Jul 8;69(2):257–9.
Carter-Coman, C., et al. “Strain-modulated epitaxy: A flexible approach to 3-D band structure engineering without surface patterning.” Applied Physics Letters, vol. 69, no. 2, July 1996, pp. 257–59. Scopus, doi:10.1063/1.117942.
Carter-Coman C, Brown AS, Bicknell-Tassius R, Jokerst NM, Allen M. Strain-modulated epitaxy: A flexible approach to 3-D band structure engineering without surface patterning. Applied Physics Letters. 1996 Jul 8;69(2):257–259.

Published In

Applied Physics Letters

DOI

ISSN

0003-6951

Publication Date

July 8, 1996

Volume

69

Issue

2

Start / End Page

257 / 259

Related Subject Headings

  • Applied Physics
  • 51 Physical sciences
  • 40 Engineering
  • 10 Technology
  • 09 Engineering
  • 02 Physical Sciences