Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates
Publication
, Journal Article
Vrazel, M; Chang, JJ; Brooke, M; Jokerst, NM; Joo, Y; Carastro, L; Dagnall, G; Brown, A
Published in: Proceedings - Electronic Components and Technology Conference
December 1, 2000
High frequency signal distribution in HDI/HDW substrates can be achieved using optical interconnections. To realize effective milli- and micro-haul interconnections on these substrates, the hybrid integration of independently optimized interface circuits and optoelectronic detectors is critical. Further, to realize effective cost goals, designing the optoelectronic interface for alignment tolerance is a key goal. This paper describes the design, fabrication, and test of hybrid integrated optoelectronic interface circuits designed for alignment tolerance and for integration onto an HDI/HDW substrate.
Duke Scholars
Published In
Proceedings - Electronic Components and Technology Conference
ISSN
0569-5503
Publication Date
December 1, 2000
Start / End Page
223 / 230
Citation
APA
Chicago
ICMJE
MLA
NLM
Vrazel, M., Chang, J. J., Brooke, M., Jokerst, N. M., Joo, Y., Carastro, L., … Brown, A. (2000). Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates. Proceedings - Electronic Components and Technology Conference, 223–230.
Vrazel, M., J. J. Chang, M. Brooke, N. M. Jokerst, Y. Joo, L. Carastro, G. Dagnall, and A. Brown. “Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates.” Proceedings - Electronic Components and Technology Conference, December 1, 2000, 223–30.
Vrazel M, Chang JJ, Brooke M, Jokerst NM, Joo Y, Carastro L, et al. Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates. Proceedings - Electronic Components and Technology Conference. 2000 Dec 1;223–30.
Vrazel, M., et al. “Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates.” Proceedings - Electronic Components and Technology Conference, Dec. 2000, pp. 223–30.
Vrazel M, Chang JJ, Brooke M, Jokerst NM, Joo Y, Carastro L, Dagnall G, Brown A. Analysis of alignment tolerant hybrid optoelectronic receivers for high density interconnection substrates. Proceedings - Electronic Components and Technology Conference. 2000 Dec 1;223–230.
Published In
Proceedings - Electronic Components and Technology Conference
ISSN
0569-5503
Publication Date
December 1, 2000
Start / End Page
223 / 230