Proof-concept collaboration model for advanced packaging research at MCNC
Publication
, Journal Article
Fair, RB; Turlik, I
Published in: Proceedings of SPIE - The International Society for Optical Engineering
December 1, 1993
MCNC's research in flip chip processing has occurred over several years within the center and in concert with several universities. In order to make the research available to industry, a flip chip technology center (FCTC) has been established within MCNC to help industry evaluate the technology applied to their own ICs. The model for FCTC is the proof-of-concept model which allows for promising technologies to be actively transferred with the cooperation and shared costs of industry with leverage from the federal government.
Duke Scholars
Published In
Proceedings of SPIE - The International Society for Optical Engineering
ISSN
0277-786X
Publication Date
December 1, 1993
Volume
1986
Start / End Page
552 / 555
Related Subject Headings
- 5102 Atomic, molecular and optical physics
- 4009 Electronics, sensors and digital hardware
- 4006 Communications engineering
Citation
APA
Chicago
ICMJE
MLA
NLM
Fair, R. B., & Turlik, I. (1993). Proof-concept collaboration model for advanced packaging research at MCNC. Proceedings of SPIE - The International Society for Optical Engineering, 1986, 552–555.
Fair, R. B., and I. Turlik. “Proof-concept collaboration model for advanced packaging research at MCNC.” Proceedings of SPIE - The International Society for Optical Engineering 1986 (December 1, 1993): 552–55.
Fair RB, Turlik I. Proof-concept collaboration model for advanced packaging research at MCNC. Proceedings of SPIE - The International Society for Optical Engineering. 1993 Dec 1;1986:552–5.
Fair, R. B., and I. Turlik. “Proof-concept collaboration model for advanced packaging research at MCNC.” Proceedings of SPIE - The International Society for Optical Engineering, vol. 1986, Dec. 1993, pp. 552–55.
Fair RB, Turlik I. Proof-concept collaboration model for advanced packaging research at MCNC. Proceedings of SPIE - The International Society for Optical Engineering. 1993 Dec 1;1986:552–555.
Published In
Proceedings of SPIE - The International Society for Optical Engineering
ISSN
0277-786X
Publication Date
December 1, 1993
Volume
1986
Start / End Page
552 / 555
Related Subject Headings
- 5102 Atomic, molecular and optical physics
- 4009 Electronics, sensors and digital hardware
- 4006 Communications engineering