High-density flexible interconnect for two-dimensional ultrasound arrays.
Publication
, Journal Article
Fiering, JO; Hultman, P; Lee, W; Light, ED; Smith, SW
Published in: IEEE transactions on ultrasonics, ferroelectrics, and frequency control
January 2000
We present a method for fabricating flexible multilayer circuits for interconnection to 2-D array ultrasound transducers. In addition, we describe four 2-D arrays in which such flexible interconnect is implemented, including transthoracic arrays with 438 channels operating at up to 7 MHz and intracardiac catheter arrays with 70 channels operating at up to 7 MHz. We employ thin and thick film microfabrication techniques to batch produce the interconnect circuits with minimum dimensions of 12-mum lines, 40-mum vias, and 150-mum array pitch. The arrays show 50-Omega insertion loss of -60 to -84 dB and a fractional bandwidth of 27 to 67%. The arrays are used to obtain real time, in vivo volumetric scans.
Duke Scholars
Published In
IEEE transactions on ultrasonics, ferroelectrics, and frequency control
DOI
EISSN
1525-8955
ISSN
0885-3010
Publication Date
January 2000
Volume
47
Issue
3
Start / End Page
764 / 770
Related Subject Headings
- Acoustics
- 51 Physical sciences
- 40 Engineering
- 09 Engineering
- 02 Physical Sciences
Citation
APA
Chicago
ICMJE
MLA
NLM
Fiering, J. O., Hultman, P., Lee, W., Light, E. D., & Smith, S. W. (2000). High-density flexible interconnect for two-dimensional ultrasound arrays. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 47(3), 764–770. https://doi.org/10.1109/58.842067
Fiering, J. O., P. Hultman, W. Lee, E. D. Light, and S. W. Smith. “High-density flexible interconnect for two-dimensional ultrasound arrays.” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 47, no. 3 (January 2000): 764–70. https://doi.org/10.1109/58.842067.
Fiering JO, Hultman P, Lee W, Light ED, Smith SW. High-density flexible interconnect for two-dimensional ultrasound arrays. IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 2000 Jan;47(3):764–70.
Fiering, J. O., et al. “High-density flexible interconnect for two-dimensional ultrasound arrays.” IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 47, no. 3, Jan. 2000, pp. 764–70. Epmc, doi:10.1109/58.842067.
Fiering JO, Hultman P, Lee W, Light ED, Smith SW. High-density flexible interconnect for two-dimensional ultrasound arrays. IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 2000 Jan;47(3):764–770.
Published In
IEEE transactions on ultrasonics, ferroelectrics, and frequency control
DOI
EISSN
1525-8955
ISSN
0885-3010
Publication Date
January 2000
Volume
47
Issue
3
Start / End Page
764 / 770
Related Subject Headings
- Acoustics
- 51 Physical sciences
- 40 Engineering
- 09 Engineering
- 02 Physical Sciences