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Hotspot Size Effect on Conductive Heat Spreading

Publication ,  Journal Article
Guo, HA; Wiedenheft, KF; Chen, CH
Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology
September 1, 2017

Solid heat spreaders, particularly those made of copper or graphite, are often benchmark solutions for hotspot thermal management. In this paper, we present exact and approximate analytical solutions of steady-state hotspot cooling with a planar heat spreader, which is subjected to adiabatic conditions except for a hotspot centered at the top surface and a constant temperature at the bottom surface. The approximate solution bridges exact solutions at two limits of hotspot size: infinitesimal hotspot at the center and uniform heat flux across the spreader. The approximate solution accounts for variable hotspot size and anisotropic thermal conductivity in a compact form, which is useful for estimating thermal parameters such as conduction shape factor and effective thermal conductivity.

Duke Scholars

Published In

IEEE Transactions on Components, Packaging and Manufacturing Technology

DOI

ISSN

2156-3950

Publication Date

September 1, 2017

Volume

7

Issue

9

Start / End Page

1459 / 1464

Related Subject Headings

  • 4014 Manufacturing engineering
  • 4009 Electronics, sensors and digital hardware
 

Citation

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Guo, H. A., Wiedenheft, K. F., & Chen, C. H. (2017). Hotspot Size Effect on Conductive Heat Spreading. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(9), 1459–1464. https://doi.org/10.1109/TCPMT.2017.2704419
Guo, H. A., K. F. Wiedenheft, and C. H. Chen. “Hotspot Size Effect on Conductive Heat Spreading.” IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 9 (September 1, 2017): 1459–64. https://doi.org/10.1109/TCPMT.2017.2704419.
Guo HA, Wiedenheft KF, Chen CH. Hotspot Size Effect on Conductive Heat Spreading. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2017 Sep 1;7(9):1459–64.
Guo, H. A., et al. “Hotspot Size Effect on Conductive Heat Spreading.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 9, Sept. 2017, pp. 1459–64. Scopus, doi:10.1109/TCPMT.2017.2704419.
Guo HA, Wiedenheft KF, Chen CH. Hotspot Size Effect on Conductive Heat Spreading. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2017 Sep 1;7(9):1459–1464.

Published In

IEEE Transactions on Components, Packaging and Manufacturing Technology

DOI

ISSN

2156-3950

Publication Date

September 1, 2017

Volume

7

Issue

9

Start / End Page

1459 / 1464

Related Subject Headings

  • 4014 Manufacturing engineering
  • 4009 Electronics, sensors and digital hardware