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High frequency analysis of a dynamically coupled parallel plate system

Publication ,  Conference
Culver, DR; Dowell, E
Published in: ASME 2017 Dynamic Systems and Control Conference, DSCC 2017
January 1, 2017

The behavior of a system comprised of two parallel plates coupled by a discrete, linear spring and damper is studied. Classical Modal Analysis (CMA) is used to illustrate this behavior, while specifically observing the effects of varying the stiffness and damping ratio of the coupling elements. Conditions under which the coupling may be approximated as rigid are identified. Additionally, conditions under which the coupling displacement reaches its maximum and minimum values are identified. This work also lays the groundwork for extending Asymptotic Modal Analysis (AMA) to systems with discrete, elastic, and dissipative coupling.

Duke Scholars

Published In

ASME 2017 Dynamic Systems and Control Conference, DSCC 2017

DOI

Publication Date

January 1, 2017

Volume

3
 

Citation

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Culver, D. R., & Dowell, E. (2017). High frequency analysis of a dynamically coupled parallel plate system. In ASME 2017 Dynamic Systems and Control Conference, DSCC 2017 (Vol. 3). https://doi.org/10.1115/DSCC2017-5214
Culver, D. R., and E. Dowell. “High frequency analysis of a dynamically coupled parallel plate system.” In ASME 2017 Dynamic Systems and Control Conference, DSCC 2017, Vol. 3, 2017. https://doi.org/10.1115/DSCC2017-5214.
Culver DR, Dowell E. High frequency analysis of a dynamically coupled parallel plate system. In: ASME 2017 Dynamic Systems and Control Conference, DSCC 2017. 2017.
Culver, D. R., and E. Dowell. “High frequency analysis of a dynamically coupled parallel plate system.” ASME 2017 Dynamic Systems and Control Conference, DSCC 2017, vol. 3, 2017. Scopus, doi:10.1115/DSCC2017-5214.
Culver DR, Dowell E. High frequency analysis of a dynamically coupled parallel plate system. ASME 2017 Dynamic Systems and Control Conference, DSCC 2017. 2017.

Published In

ASME 2017 Dynamic Systems and Control Conference, DSCC 2017

DOI

Publication Date

January 1, 2017

Volume

3