Notice of Removal: Low-cost 3D ultrasound with any probe: A sensor-based approach
Conferences
Herickhoff, C; Morgan, M; Broder, J; Dahl, J
Published in: IEEE International Ultrasonics Symposium Ius
October 31, 2017
Volumetric 3D ultrasound captures a region of interest more completely than cross-sectional 2D imaging, but 3D implementation has been limited. Mechanical wobbler and matrix-array probes can do 3D imaging, but these probes tend to be bulky and/or expensive, and precise orientation of the image with respect to the patient is not measured. In this work, we present a method of acquiring volumetric 3D ultrasound images with known patient orientation by utilizing a low-cost sensor. This method enables 3D imaging with any 2D imaging probe; this versatile and practical approach may increase the clinical utilization of 3D ultrasound.
Duke Scholars
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IEEE International Ultrasonics Symposium Ius
DOI
EISSN
1948-5727
ISSN
1948-5719
Publication Date
October 31, 2017
Volume
0
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Chicago
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Herickhoff, C., Morgan, M., Broder, J., & Dahl, J. (2017). Notice of Removal: Low-cost 3D ultrasound with any probe: A sensor-based approach. In IEEE International Ultrasonics Symposium Ius (Vol. 0). https://doi.org/10.1109/ULTSYM.2017.8092504
Herickhoff, C., M. Morgan, J. Broder, and J. Dahl. “Notice of Removal: Low-cost 3D ultrasound with any probe: A sensor-based approach.” In IEEE International Ultrasonics Symposium Ius, Vol. 0, 2017. https://doi.org/10.1109/ULTSYM.2017.8092504.
Herickhoff C, Morgan M, Broder J, Dahl J. Notice of Removal: Low-cost 3D ultrasound with any probe: A sensor-based approach. In: IEEE International Ultrasonics Symposium Ius. 2017.
Herickhoff, C., et al. “Notice of Removal: Low-cost 3D ultrasound with any probe: A sensor-based approach.” IEEE International Ultrasonics Symposium Ius, vol. 0, 2017. Scopus, doi:10.1109/ULTSYM.2017.8092504.
Herickhoff C, Morgan M, Broder J, Dahl J. Notice of Removal: Low-cost 3D ultrasound with any probe: A sensor-based approach. IEEE International Ultrasonics Symposium Ius. 2017.
Published In
IEEE International Ultrasonics Symposium Ius
DOI
EISSN
1948-5727
ISSN
1948-5719
Publication Date
October 31, 2017
Volume
0