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A fine-grain, high-throughput architecture using through-wafer optical interconnect

Publication ,  Conference
Lacy, WS; Camperi-Ginestet, C; Buchanan, B; Scott Wills, D; Jokerst, NM; Brooke, M
Published in: Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994
January 1, 1994

This paper presents a highly parallel, three dimensionally interconnected system to process high-throughput stream data such as images. Optical interconnect at wavelengths to which silicon is transparent is used to create the 3D system. Thin film InP/InGaAsP-based emitters and detectors operating at 1.3 microns are bonded to the silicon circuitry, and emit through the silicon wafer to create the vertical optical interconnect. Foundry-fabricated Si circuits are post processed using standard, low cost, high yield microfabrication techniques to integrate the thin film devices with the circuits. In order to meet off-chip I/O requirements, a high-bandwidth, three dimensional optical network is also being designed. Using through-wafer optical interconnect, a new offset cube topology has been created, and naming and routing schemes have been developed. Its performance is comparable to that of a three dimensional mesh. A processing architecture has also been defined that minimizes overhead for basic parallel operations. A complete processing node for high-throughput, low-memory applications can be implemented using a fraction of a chip.

Duke Scholars

Published In

Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994

DOI

Publication Date

January 1, 1994

Start / End Page

27 / 36
 

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Lacy, W. S., Camperi-Ginestet, C., Buchanan, B., Scott Wills, D., Jokerst, N. M., & Brooke, M. (1994). A fine-grain, high-throughput architecture using through-wafer optical interconnect. In Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994 (pp. 27–36). https://doi.org/10.1109/MPPOI.1994.336641
Lacy, W. S., C. Camperi-Ginestet, B. Buchanan, D. Scott Wills, N. M. Jokerst, and M. Brooke. “A fine-grain, high-throughput architecture using through-wafer optical interconnect.” In Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994, 27–36, 1994. https://doi.org/10.1109/MPPOI.1994.336641.
Lacy WS, Camperi-Ginestet C, Buchanan B, Scott Wills D, Jokerst NM, Brooke M. A fine-grain, high-throughput architecture using through-wafer optical interconnect. In: Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. 1994. p. 27–36.
Lacy, W. S., et al. “A fine-grain, high-throughput architecture using through-wafer optical interconnect.” Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994, 1994, pp. 27–36. Scopus, doi:10.1109/MPPOI.1994.336641.
Lacy WS, Camperi-Ginestet C, Buchanan B, Scott Wills D, Jokerst NM, Brooke M. A fine-grain, high-throughput architecture using through-wafer optical interconnect. Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. 1994. p. 27–36.

Published In

Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994

DOI

Publication Date

January 1, 1994

Start / End Page

27 / 36