OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES
Publication
, Conference
BEJAN, A; LEE, SW
Published in: TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2
1993
Duke Scholars
Published In
TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2
ISBN
1-56700-015-0
Publication Date
1993
Start / End Page
804 / 810
Citation
APA
Chicago
ICMJE
MLA
NLM
BEJAN, A., & LEE, S. W. (1993). OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES. In TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2 (pp. 804–810).
BEJAN, A., and S. W. LEE. “OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES.” In TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2, 804–10, 1993.
BEJAN A, LEE SW. OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES. In: TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2. 1993. p. 804–10.
BEJAN, A., and S. W. LEE. “OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES.” TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2, 1993, pp. 804–10.
BEJAN A, LEE SW. OPTIMAL GEOMETRY OF CONVECTION COOLED ELECTRONIC PACKAGES. TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2. 1993. p. 804–810.
Published In
TRANSPORT PHENOMENA IN THERMAL ENGINEERING, VOLS 1 AND 2
ISBN
1-56700-015-0
Publication Date
1993
Start / End Page
804 / 810