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Ekiden: A Platform for Confidentiality-Preserving, Trustworthy, and Performant Smart Contracts

Publication ,  Journal Article
Cheng, R; Zhang, F; Kos, J; He, W; Hynes, N; Johnson, NM; Juels, A; Miller, A; Song, D
Published in: IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019
2019

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IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019

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Publication Date

2019

Start / End Page

185 / 200

Publisher

IEEE
 

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Cheng, R., Zhang, F., Kos, J., He, W., Hynes, N., Johnson, N. M., … Song, D. (2019). Ekiden: A Platform for Confidentiality-Preserving, Trustworthy, and Performant Smart Contracts. IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019, 185–200. https://doi.org/10.1109/EuroSP.2019.00023
Cheng, Raymond, Fan Zhang, Jernej Kos, Warren He, Nicholas Hynes, Noah M. Johnson, Ari Juels, Andrew Miller, and Dawn Song. “Ekiden: A Platform for Confidentiality-Preserving, Trustworthy, and Performant Smart Contracts.” IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019, 2019, 185–200. https://doi.org/10.1109/EuroSP.2019.00023.
Cheng R, Zhang F, Kos J, He W, Hynes N, Johnson NM, et al. Ekiden: A Platform for Confidentiality-Preserving, Trustworthy, and Performant Smart Contracts. IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019. 2019;185–200.
Cheng, Raymond, et al. “Ekiden: A Platform for Confidentiality-Preserving, Trustworthy, and Performant Smart Contracts.” IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019, IEEE, 2019, pp. 185–200. Manual, doi:10.1109/EuroSP.2019.00023.
Cheng R, Zhang F, Kos J, He W, Hynes N, Johnson NM, Juels A, Miller A, Song D. Ekiden: A Platform for Confidentiality-Preserving, Trustworthy, and Performant Smart Contracts. IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019. IEEE; 2019;185–200.

Published In

IEEE European Symposium on Security and Privacy, EuroS&P 2019, Stockholm, Sweden, June 17-19, 2019

DOI

Publication Date

2019

Start / End Page

185 / 200

Publisher

IEEE