Sealed-Glass Proofs: Using Transparent Enclaves to Prove and Sell Knowledge
Publication
, Conference
Tramèr, F; Zhang, F; Lin, H; Hubaux, J-P; Juels, A; Shi, E
Published in: 2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017
2017
Duke Scholars
Altmetric Attention Stats
Dimensions Citation Stats
Published In
2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017
DOI
Publication Date
2017
Start / End Page
19 / 34
Publisher
IEEE
Citation
APA
Chicago
ICMJE
MLA
NLM
Tramèr, F., Zhang, F., Lin, H., Hubaux, J.-P., Juels, A., & Shi, E. (2017). Sealed-Glass Proofs: Using Transparent Enclaves to Prove and Sell Knowledge. In 2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017 (pp. 19–34). IEEE. https://doi.org/10.1109/EuroSP.2017.28
Tramèr, Florian, Fan Zhang, Huang Lin, Jean-Pierre Hubaux, Ari Juels, and Elaine Shi. “Sealed-Glass Proofs: Using Transparent Enclaves to Prove and Sell Knowledge.” In 2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017, 19–34. IEEE, 2017. https://doi.org/10.1109/EuroSP.2017.28.
Tramèr F, Zhang F, Lin H, Hubaux J-P, Juels A, Shi E. Sealed-Glass Proofs: Using Transparent Enclaves to Prove and Sell Knowledge. In: 2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017. IEEE; 2017. p. 19–34.
Tramèr, Florian, et al. “Sealed-Glass Proofs: Using Transparent Enclaves to Prove and Sell Knowledge.” 2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017, IEEE, 2017, pp. 19–34. Manual, doi:10.1109/EuroSP.2017.28.
Tramèr F, Zhang F, Lin H, Hubaux J-P, Juels A, Shi E. Sealed-Glass Proofs: Using Transparent Enclaves to Prove and Sell Knowledge. 2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017. IEEE; 2017. p. 19–34.
Published In
2017 IEEE European Symposium on Security and Privacy, EuroS&P 2017, Paris, France, April 26-28, 2017
DOI
Publication Date
2017
Start / End Page
19 / 34
Publisher
IEEE