IMC growth at the interface of Sn-2.0Ag-2.5Zn solder joints with Cu, Ni, and Ni-W substrates

Growth of intermetallic compounds (IMC) at the interface of Sn-2.0Ag-2.5Zn solder joints with Cu, Ni, and Ni-W substrates have been investigated. For the Cu substrate, a Cu5Zn8 IMC layer with Ag3Sn particles on top was observed at the interface; this acted as a barrier layer preventing further growth of Cu-Sn IMC. For the Ni substrate, a thin Ni3Sn4 film was observed between the solder and the Ni layer; the thickness of the film increased slowly and steadily with aging. For the Ni-W substrate, a thin Ni3Sn4 film was observed between the solder and Ni-W layer. During the aging process a thin layer of the Ni-W substrate was transformed into a bright layer, and the thickness of bright layer increased with aging.

Duke Scholars

Author Haozhe Wang Electrical and Computer Engineering