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Hot deformation behavior and processing map of B30 copper-nickel alloy

Publication ,  Journal Article
Quan, Z; Wang, Z; Du, W; Sun, Y; Wang, Q
Published in: Cailiao Gongcheng Journal of Materials Engineering
July 1, 2023

Hot deformation behavior of as-cast BFe30-1-1 alloy was systematically investigated at the temperature of 750-1000 ℃ and the strain rate of 0.01-10 s-1. The effects of friction and adiabatic on the flow stress were analyzed. The stain-stress curves caused by frictional and adiabatic effects were corrected. The corrected curves were used to establish the Arrhenius constitutive equation, so as to the processing map of as-cast BFe30-1-1 alloy on the basis of dynamic material model. The microstructure evolution of alloy during hot deformation was investigated, which shows that the flow-stress increases with the decrease of deformation temperature and the increase of strain rate. Friction and temperature rise can influence the flow stress curves of alloys. The dynamic recrystallization occurs during the hot deformation. The average relative error between the predicted value and the experimental value of peak stress is less than 3.77%. It shows that the constitutive equation can accurately predict the flow stress of different hot deformation conditions. According to the hot processing map and microstructural analysis, the reasonable range of thermoplastic deformation process for BFe30-1-1 copper-nickel alloy is the deformation temperature of 900-1000 ℃ and the strain rate of 0.04 - 0.16 s-1. And more dynamic recrystallization grains of the alloy can be obtained at this deformation condition.

Duke Scholars

Published In

Cailiao Gongcheng Journal of Materials Engineering

DOI

ISSN

1001-4381

Publication Date

July 1, 2023

Volume

51

Issue

7

Start / End Page

215 / 226

Related Subject Headings

  • Materials
 

Citation

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Quan, Z., Wang, Z., Du, W., Sun, Y., & Wang, Q. (2023). Hot deformation behavior and processing map of B30 copper-nickel alloy. Cailiao Gongcheng Journal of Materials Engineering, 51(7), 215–226. https://doi.org/10.11868/j.issn.1001-4381.2022.000181
Quan, Z., Z. Wang, W. Du, Y. Sun, and Q. Wang. “Hot deformation behavior and processing map of B30 copper-nickel alloy.” Cailiao Gongcheng Journal of Materials Engineering 51, no. 7 (July 1, 2023): 215–26. https://doi.org/10.11868/j.issn.1001-4381.2022.000181.
Quan Z, Wang Z, Du W, Sun Y, Wang Q. Hot deformation behavior and processing map of B30 copper-nickel alloy. Cailiao Gongcheng Journal of Materials Engineering. 2023 Jul 1;51(7):215–26.
Quan, Z., et al. “Hot deformation behavior and processing map of B30 copper-nickel alloy.” Cailiao Gongcheng Journal of Materials Engineering, vol. 51, no. 7, July 2023, pp. 215–26. Scopus, doi:10.11868/j.issn.1001-4381.2022.000181.
Quan Z, Wang Z, Du W, Sun Y, Wang Q. Hot deformation behavior and processing map of B30 copper-nickel alloy. Cailiao Gongcheng Journal of Materials Engineering. 2023 Jul 1;51(7):215–226.

Published In

Cailiao Gongcheng Journal of Materials Engineering

DOI

ISSN

1001-4381

Publication Date

July 1, 2023

Volume

51

Issue

7

Start / End Page

215 / 226

Related Subject Headings

  • Materials