Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers
Publication
, Conference
Chung, GY; Loboda, MJ; Marinella, MJ; Schroder, DK; Klein, PB; Isaacs-Smith, T; Williams, JW
Published in: Materials Science Forum
September 26, 2008
Duke Scholars
Published In
Materials Science Forum
DOI
EISSN
1662-9752
Publication Date
September 26, 2008
Volume
600-603
Start / End Page
485 / 488
Publisher
Trans Tech Publications, Ltd.
Related Subject Headings
- Nanoscience & Nanotechnology
- Materials
- 4016 Materials engineering
- 0912 Materials Engineering
- 0306 Physical Chemistry (incl. Structural)
Citation
APA
Chicago
ICMJE
MLA
NLM
Chung, G. Y., Loboda, M. J., Marinella, M. J., Schroder, D. K., Klein, P. B., Isaacs-Smith, T., & Williams, J. W. (2008). Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers. In Materials Science Forum (Vol. 600–603, pp. 485–488). Trans Tech Publications, Ltd. https://doi.org/10.4028/www.scientific.net/msf.600-603.485
Chung, Gil Yong, Mark J. Loboda, M. J. Marinella, D. K. Schroder, Paul B. Klein, Tamara Isaacs-Smith, and J. W. Williams. “Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers.” In Materials Science Forum, 600–603:485–88. Trans Tech Publications, Ltd., 2008. https://doi.org/10.4028/www.scientific.net/msf.600-603.485.
Chung GY, Loboda MJ, Marinella MJ, Schroder DK, Klein PB, Isaacs-Smith T, et al. Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers. In: Materials Science Forum. Trans Tech Publications, Ltd.; 2008. p. 485–8.
Chung, Gil Yong, et al. “Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers.” Materials Science Forum, vol. 600–603, Trans Tech Publications, Ltd., 2008, pp. 485–88. Crossref, doi:10.4028/www.scientific.net/msf.600-603.485.
Chung GY, Loboda MJ, Marinella MJ, Schroder DK, Klein PB, Isaacs-Smith T, Williams JW. Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers. Materials Science Forum. Trans Tech Publications, Ltd.; 2008. p. 485–488.
Published In
Materials Science Forum
DOI
EISSN
1662-9752
Publication Date
September 26, 2008
Volume
600-603
Start / End Page
485 / 488
Publisher
Trans Tech Publications, Ltd.
Related Subject Headings
- Nanoscience & Nanotechnology
- Materials
- 4016 Materials engineering
- 0912 Materials Engineering
- 0306 Physical Chemistry (incl. Structural)