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The structure of films formed by γ-aminopropyltriethoxysilane adsorbed onto copper

Publication ,  Journal Article
Boerio, FJ; Williams, JW; Burkstrand, JM
Published in: Journal of Colloid and Interface Science
February 1983

Duke Scholars

Published In

Journal of Colloid and Interface Science

DOI

ISSN

0021-9797

Publication Date

February 1983

Volume

91

Issue

2

Start / End Page

485 / 495

Publisher

Elsevier BV

Related Subject Headings

  • Chemical Physics
  • 51 Physical sciences
  • 40 Engineering
  • 34 Chemical sciences
  • 09 Engineering
  • 03 Chemical Sciences
  • 02 Physical Sciences
 

Citation

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MLA
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Boerio, F. J., Williams, J. W., & Burkstrand, J. M. (1983). The structure of films formed by γ-aminopropyltriethoxysilane adsorbed onto copper. Journal of Colloid and Interface Science, 91(2), 485–495. https://doi.org/10.1016/0021-9797(83)90362-4
Boerio, F. J., J. W. Williams, and J. M. Burkstrand. “The structure of films formed by γ-aminopropyltriethoxysilane adsorbed onto copper.” Journal of Colloid and Interface Science 91, no. 2 (February 1983): 485–95. https://doi.org/10.1016/0021-9797(83)90362-4.
Boerio FJ, Williams JW, Burkstrand JM. The structure of films formed by γ-aminopropyltriethoxysilane adsorbed onto copper. Journal of Colloid and Interface Science. 1983 Feb;91(2):485–95.
Boerio, F. J., et al. “The structure of films formed by γ-aminopropyltriethoxysilane adsorbed onto copper.” Journal of Colloid and Interface Science, vol. 91, no. 2, Elsevier BV, Feb. 1983, pp. 485–95. Crossref, doi:10.1016/0021-9797(83)90362-4.
Boerio FJ, Williams JW, Burkstrand JM. The structure of films formed by γ-aminopropyltriethoxysilane adsorbed onto copper. Journal of Colloid and Interface Science. Elsevier BV; 1983 Feb;91(2):485–495.
Journal cover image

Published In

Journal of Colloid and Interface Science

DOI

ISSN

0021-9797

Publication Date

February 1983

Volume

91

Issue

2

Start / End Page

485 / 495

Publisher

Elsevier BV

Related Subject Headings

  • Chemical Physics
  • 51 Physical sciences
  • 40 Engineering
  • 34 Chemical sciences
  • 09 Engineering
  • 03 Chemical Sciences
  • 02 Physical Sciences