Bejan, A., & Lee, S. W. (1994). Optimal Geometry of Convection Cooled Electronic Packages, 277–291. https://doi.org/10.1007/978-94-011-1090-7_14

Bejan, Adrian, and Sang W. Lee. “Optimal Geometry of Convection Cooled Electronic Packages,” 1994, 277–91. https://doi.org/10.1007/978-94-011-1090-7_14.

Bejan A, Lee SW. Optimal Geometry of Convection Cooled Electronic Packages. 1994;277–91.

Bejan, Adrian, and Sang W. Lee. Optimal Geometry of Convection Cooled Electronic Packages. Springer Netherlands, 1994, pp. 277–91. Crossref, doi:10.1007/978-94-011-1090-7_14.

Bejan A, Lee SW. Optimal Geometry of Convection Cooled Electronic Packages. Springer Netherlands; 1994;277–291.