Accurate, high speed modeling of integrated passive devices in multichip modules
Publication
, Journal Article
Poddar, R; Brooke, M
Published in: IEEE Topical Meeting on Electrical Performance of Electronic Packaging
December 1, 1996
A new method for the predictive modeling of passive devices with interactions based upon measurement and primitive cell characterization is presented. Building block RLC equivalents can be utilized for arbitrary geometry device modeling in high speed circuit simulators.
Duke Scholars
Published In
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Publication Date
December 1, 1996
Start / End Page
184 / 186
Citation
APA
Chicago
ICMJE
MLA
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Poddar, R., & Brooke, M. (1996). Accurate, high speed modeling of integrated passive devices in multichip modules. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, 184–186.
Poddar, R., and M. Brooke. “Accurate, high speed modeling of integrated passive devices in multichip modules.” IEEE Topical Meeting on Electrical Performance of Electronic Packaging, December 1, 1996, 184–86.
Poddar R, Brooke M. Accurate, high speed modeling of integrated passive devices in multichip modules. IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1996 Dec 1;184–6.
Poddar, R., and M. Brooke. “Accurate, high speed modeling of integrated passive devices in multichip modules.” IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Dec. 1996, pp. 184–86.
Poddar R, Brooke M. Accurate, high speed modeling of integrated passive devices in multichip modules. IEEE Topical Meeting on Electrical Performance of Electronic Packaging. 1996 Dec 1;184–186.
Published In
IEEE Topical Meeting on Electrical Performance of Electronic Packaging
Publication Date
December 1, 1996
Start / End Page
184 / 186