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High density focal plane signal processing using 3-D vertical interconnects

Publication ,  Journal Article
Buchanan, B; Camperi-Ginestet, C; Morris, T; Brooke, M; DeWeerth, S; Jokerst, N; Allen, M
Published in: Midwest Symposium on Circuits and Systems
December 1, 1994

A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity to alogrithmically encoded frequency signal.

Duke Scholars

Published In

Midwest Symposium on Circuits and Systems

Publication Date

December 1, 1994

Volume

1

Start / End Page

191 / 194
 

Citation

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Buchanan, B., Camperi-Ginestet, C., Morris, T., Brooke, M., DeWeerth, S., Jokerst, N., & Allen, M. (1994). High density focal plane signal processing using 3-D vertical interconnects. Midwest Symposium on Circuits and Systems, 1, 191–194.
Buchanan, B., C. Camperi-Ginestet, T. Morris, M. Brooke, S. DeWeerth, N. Jokerst, and M. Allen. “High density focal plane signal processing using 3-D vertical interconnects.” Midwest Symposium on Circuits and Systems 1 (December 1, 1994): 191–94.
Buchanan B, Camperi-Ginestet C, Morris T, Brooke M, DeWeerth S, Jokerst N, et al. High density focal plane signal processing using 3-D vertical interconnects. Midwest Symposium on Circuits and Systems. 1994 Dec 1;1:191–4.
Buchanan, B., et al. “High density focal plane signal processing using 3-D vertical interconnects.” Midwest Symposium on Circuits and Systems, vol. 1, Dec. 1994, pp. 191–94.
Buchanan B, Camperi-Ginestet C, Morris T, Brooke M, DeWeerth S, Jokerst N, Allen M. High density focal plane signal processing using 3-D vertical interconnects. Midwest Symposium on Circuits and Systems. 1994 Dec 1;1:191–194.

Published In

Midwest Symposium on Circuits and Systems

Publication Date

December 1, 1994

Volume

1

Start / End Page

191 / 194