High density focal plane signal processing using 3-D vertical interconnects
Publication
, Journal Article
Buchanan, B; Camperi-Ginestet, C; Morris, T; Brooke, M; DeWeerth, S; Jokerst, N; Allen, M
Published in: Midwest Symposium on Circuits and Systems
December 1, 1994
A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity to alogrithmically encoded frequency signal.
Duke Scholars
Published In
Midwest Symposium on Circuits and Systems
Publication Date
December 1, 1994
Volume
1
Start / End Page
191 / 194
Citation
APA
Chicago
ICMJE
MLA
NLM
Buchanan, B., Camperi-Ginestet, C., Morris, T., Brooke, M., DeWeerth, S., Jokerst, N., & Allen, M. (1994). High density focal plane signal processing using 3-D vertical interconnects. Midwest Symposium on Circuits and Systems, 1, 191–194.
Buchanan, B., C. Camperi-Ginestet, T. Morris, M. Brooke, S. DeWeerth, N. Jokerst, and M. Allen. “High density focal plane signal processing using 3-D vertical interconnects.” Midwest Symposium on Circuits and Systems 1 (December 1, 1994): 191–94.
Buchanan B, Camperi-Ginestet C, Morris T, Brooke M, DeWeerth S, Jokerst N, et al. High density focal plane signal processing using 3-D vertical interconnects. Midwest Symposium on Circuits and Systems. 1994 Dec 1;1:191–4.
Buchanan, B., et al. “High density focal plane signal processing using 3-D vertical interconnects.” Midwest Symposium on Circuits and Systems, vol. 1, Dec. 1994, pp. 191–94.
Buchanan B, Camperi-Ginestet C, Morris T, Brooke M, DeWeerth S, Jokerst N, Allen M. High density focal plane signal processing using 3-D vertical interconnects. Midwest Symposium on Circuits and Systems. 1994 Dec 1;1:191–194.
Published In
Midwest Symposium on Circuits and Systems
Publication Date
December 1, 1994
Volume
1
Start / End Page
191 / 194