Physical design of optoelectronic system-on-a-package using optical waveguide interconnects
Publication
, Journal Article
Seo, CS; Chatterjee, A; Jokerst, NM
Published in: Proceedings - Electronic Components and Technology Conference
December 27, 2004
In this paper, we develop a computer-aided design (CAD) tool for physical design of optoelectronic system-on-a-package (SOP) using optical waveguide interconnects. The tool assigns the optimal location to modules and replaces long electrical interconnects with optical waveguide interconnects in order to maximize the overall performance of the optoelectronic system-on-a-package. More than 47% improvement in system-on-a-package performance is obtained through the use of optical waveguide interconnects.
Duke Scholars
Published In
Proceedings - Electronic Components and Technology Conference
ISSN
0569-5503
Publication Date
December 27, 2004
Volume
1
Start / End Page
29 / 34
Citation
APA
Chicago
ICMJE
MLA
NLM
Seo, C. S., Chatterjee, A., & Jokerst, N. M. (2004). Physical design of optoelectronic system-on-a-package using optical waveguide interconnects. Proceedings - Electronic Components and Technology Conference, 1, 29–34.
Seo, C. S., A. Chatterjee, and N. M. Jokerst. “Physical design of optoelectronic system-on-a-package using optical waveguide interconnects.” Proceedings - Electronic Components and Technology Conference 1 (December 27, 2004): 29–34.
Seo CS, Chatterjee A, Jokerst NM. Physical design of optoelectronic system-on-a-package using optical waveguide interconnects. Proceedings - Electronic Components and Technology Conference. 2004 Dec 27;1:29–34.
Seo, C. S., et al. “Physical design of optoelectronic system-on-a-package using optical waveguide interconnects.” Proceedings - Electronic Components and Technology Conference, vol. 1, Dec. 2004, pp. 29–34.
Seo CS, Chatterjee A, Jokerst NM. Physical design of optoelectronic system-on-a-package using optical waveguide interconnects. Proceedings - Electronic Components and Technology Conference. 2004 Dec 27;1:29–34.
Published In
Proceedings - Electronic Components and Technology Conference
ISSN
0569-5503
Publication Date
December 27, 2004
Volume
1
Start / End Page
29 / 34