Dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles
Publication
, Journal Article
Woodson, M; Tselev, A; Liu, J
Published in: Materials Research Society Symposium Proceedings
January 1, 2007
the size of integrated circuit elements decreases, the properties of carbon nanotubes (CNTs) become increasingly attractive for interconnect applications. To be used by industry, full characterization of the electronic properties of CNT aggregates is essential. Dielectrophoresis from CNTs suspended in liquid has been demonstrated as a simple route to bundles of aligned parallel nanotubes. We describe a method by which circuits including such bundles may be fabricated, and provide some high-frequency measurements of their electrical properties. The contributions of the contacts can be separated from those of the bundle itself. © 2007 Materials Research Society.
Duke Scholars
Published In
Materials Research Society Symposium Proceedings
DOI
ISSN
0272-9172
Publication Date
January 1, 2007
Volume
990
Start / End Page
281 / 286
Citation
APA
Chicago
ICMJE
MLA
NLM
Woodson, M., Tselev, A., & Liu, J. (2007). Dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles. Materials Research Society Symposium Proceedings, 990, 281–286. https://doi.org/10.1557/proc-0990-b04-01
Woodson, M., A. Tselev, and J. Liu. “Dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles.” Materials Research Society Symposium Proceedings 990 (January 1, 2007): 281–86. https://doi.org/10.1557/proc-0990-b04-01.
Woodson M, Tselev A, Liu J. Dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles. Materials Research Society Symposium Proceedings. 2007 Jan 1;990:281–6.
Woodson, M., et al. “Dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles.” Materials Research Society Symposium Proceedings, vol. 990, Jan. 2007, pp. 281–86. Scopus, doi:10.1557/proc-0990-b04-01.
Woodson M, Tselev A, Liu J. Dielectrophoresis-based assembly and high-frequency characterization of carbon nanotube bundles. Materials Research Society Symposium Proceedings. 2007 Jan 1;990:281–286.
Published In
Materials Research Society Symposium Proceedings
DOI
ISSN
0272-9172
Publication Date
January 1, 2007
Volume
990
Start / End Page
281 / 286