Dhawan, A., Du, Y., Batchelor, D., Wang, H.-N., Leonard, D., Misra, V., … Vo-Dinh, T. (2011). Hybrid top-down and bottom-up fabrication approach for wafer-scale plasmonic nanoplatforms. Small (Weinheim an Der Bergstrasse, Germany), 7(6), 727–731. https://doi.org/10.1002/smll.201002186

Dhawan, Anuj, Yan Du, Dale Batchelor, Hsin-Neng Wang, Donovon Leonard, Veena Misra, Mehmet Ozturk, Michael D. Gerhold, and Tuan Vo-Dinh. “Hybrid top-down and bottom-up fabrication approach for wafer-scale plasmonic nanoplatforms.” Small (Weinheim an Der Bergstrasse, Germany) 7, no. 6 (March 2011): 727–31. https://doi.org/10.1002/smll.201002186.

Dhawan A, Du Y, Batchelor D, Wang H-N, Leonard D, Misra V, et al. Hybrid top-down and bottom-up fabrication approach for wafer-scale plasmonic nanoplatforms. Small (Weinheim an der Bergstrasse, Germany). 2011 Mar;7(6):727–31.

Dhawan, Anuj, et al. “Hybrid top-down and bottom-up fabrication approach for wafer-scale plasmonic nanoplatforms.” Small (Weinheim an Der Bergstrasse, Germany), vol. 7, no. 6, Mar. 2011, pp. 727–31. Epmc, doi:10.1002/smll.201002186.

Dhawan A, Du Y, Batchelor D, Wang H-N, Leonard D, Misra V, Ozturk M, Gerhold MD, Vo-Dinh T. Hybrid top-down and bottom-up fabrication approach for wafer-scale plasmonic nanoplatforms. Small (Weinheim an der Bergstrasse, Germany). 2011 Mar;7(6):727–731.