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Performance, power, and reliability tradeoffs of STT-RAM cell subject to architecture-level requirement

Publication ,  Journal Article
Li, H; Wang, X; Ong, ZL; Wong, WF; Zhang, Y; Wang, P; Chen, Y
Published in: IEEE Transactions on Magnetics
January 1, 2011

Large switching current and long switching time have significantly limited the adoption of spin-transfer torque random access memory (STT-RAM). Technology scaling, moreover, makes it very challenging to reduce the switching current while maintaining the reliability of magnetic tunneling junction (MTJ) to be similar to that of the earlier generations. In this work, we shall exploit a key insight that in the most on-chip caches where STT-RAM is most likely to be deployed, the lifespan of the data stored in the memory cells is much shorter than the data retention time requirement assumed in STT-RAM development, namely, 4 ∼ 10 years. We also quantitatively investigated the possibility of trading off MTJ nonvolatility for improved switching performance, e.g., the switching time and/or current, under architectural level guidance. We further proposed and evaluated a hybrid memory design technique that partitions the on-chip STT-RAM cache into two parts with different nonvolatility performances so as to better fit the diverse retention time requirements of different data sets. © 2011 IEEE.

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Published In

IEEE Transactions on Magnetics

DOI

ISSN

0018-9464

Publication Date

January 1, 2011

Volume

47

Issue

10

Start / End Page

2356 / 2359

Related Subject Headings

  • Applied Physics
  • 51 Physical sciences
  • 40 Engineering
  • 09 Engineering
  • 02 Physical Sciences
 

Citation

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Li, H., Wang, X., Ong, Z. L., Wong, W. F., Zhang, Y., Wang, P., & Chen, Y. (2011). Performance, power, and reliability tradeoffs of STT-RAM cell subject to architecture-level requirement. IEEE Transactions on Magnetics, 47(10), 2356–2359. https://doi.org/10.1109/TMAG.2011.2159262
Li, H., X. Wang, Z. L. Ong, W. F. Wong, Y. Zhang, P. Wang, and Y. Chen. “Performance, power, and reliability tradeoffs of STT-RAM cell subject to architecture-level requirement.” IEEE Transactions on Magnetics 47, no. 10 (January 1, 2011): 2356–59. https://doi.org/10.1109/TMAG.2011.2159262.
Li H, Wang X, Ong ZL, Wong WF, Zhang Y, Wang P, et al. Performance, power, and reliability tradeoffs of STT-RAM cell subject to architecture-level requirement. IEEE Transactions on Magnetics. 2011 Jan 1;47(10):2356–9.
Li, H., et al. “Performance, power, and reliability tradeoffs of STT-RAM cell subject to architecture-level requirement.” IEEE Transactions on Magnetics, vol. 47, no. 10, Jan. 2011, pp. 2356–59. Scopus, doi:10.1109/TMAG.2011.2159262.
Li H, Wang X, Ong ZL, Wong WF, Zhang Y, Wang P, Chen Y. Performance, power, and reliability tradeoffs of STT-RAM cell subject to architecture-level requirement. IEEE Transactions on Magnetics. 2011 Jan 1;47(10):2356–2359.

Published In

IEEE Transactions on Magnetics

DOI

ISSN

0018-9464

Publication Date

January 1, 2011

Volume

47

Issue

10

Start / End Page

2356 / 2359

Related Subject Headings

  • Applied Physics
  • 51 Physical sciences
  • 40 Engineering
  • 09 Engineering
  • 02 Physical Sciences