Flat, cheap, and under control [electrochemical mechanical planarization]
Publication
, Journal Article
Brown, AS
Published in: IEEE Spectr. (USA)
2005
This paper describes Applied Material's wafer polishing technology, called electrochemical mechanical planarization (ECMP). ECMP is the answer to the problems of electropolishing and chemical mechanical planarization (CMP) of the chip-making process: manufacturing faster, more powerful chips without obliterating their vanishing fine and increasingly fragile features. It is designed to remove excess copper from the top of a newly formed layer of wiring on a chip without damaging the fragile insulation material, called a dielectric, beneath it. ECMP combines aspects of two other technologies, chemical mechanical planarization (CMP) and electropolishing
Duke Scholars
Published In
IEEE Spectr. (USA)
DOI
Publication Date
2005
Volume
42
Issue
1
Start / End Page
40 / 45
Related Subject Headings
- 0906 Electrical and Electronic Engineering
Citation
APA
Chicago
ICMJE
MLA
NLM
Brown, A. S. (2005). Flat, cheap, and under control [electrochemical mechanical planarization]. IEEE Spectr. (USA), 42(1), 40–45. https://doi.org/10.1109/MSPEC.2005.1377874
Brown, A. S. “Flat, cheap, and under control [electrochemical mechanical planarization].” IEEE Spectr. (USA) 42, no. 1 (2005): 40–45. https://doi.org/10.1109/MSPEC.2005.1377874.
Brown AS. Flat, cheap, and under control [electrochemical mechanical planarization]. IEEE Spectr (USA). 2005;42(1):40–5.
Brown, A. S. “Flat, cheap, and under control [electrochemical mechanical planarization].” IEEE Spectr. (USA), vol. 42, no. 1, 2005, pp. 40–45. Manual, doi:10.1109/MSPEC.2005.1377874.
Brown AS. Flat, cheap, and under control [electrochemical mechanical planarization]. IEEE Spectr (USA). 2005;42(1):40–45.
Published In
IEEE Spectr. (USA)
DOI
Publication Date
2005
Volume
42
Issue
1
Start / End Page
40 / 45
Related Subject Headings
- 0906 Electrical and Electronic Engineering