Unified model of boron diffusion in thin gate oxides: effects of F, H2, N, oxide thickness and injected Si interstitials
Publication
, Journal Article
Fair, RB
Published in: Technical Digest International Electron Devices Meeting
December 1, 1995
This work is describes the first unified network-defect-level model for B diffusion in SiO
Duke Scholars
Published In
Technical Digest International Electron Devices Meeting
ISSN
0163-1918
Publication Date
December 1, 1995
Start / End Page
85 / 88
Citation
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Fair, R. B. (1995). Unified model of boron diffusion in thin gate oxides: effects of F, H2, N, oxide thickness and injected Si interstitials. Technical Digest International Electron Devices Meeting, 85–88.
Fair, R. B. “Unified model of boron diffusion in thin gate oxides: effects of F, H2, N, oxide thickness and injected Si interstitials.” Technical Digest International Electron Devices Meeting, December 1, 1995, 85–88.
Fair RB. Unified model of boron diffusion in thin gate oxides: effects of F, H2, N, oxide thickness and injected Si interstitials. Technical Digest International Electron Devices Meeting. 1995 Dec 1;85–8.
Fair, R. B. “Unified model of boron diffusion in thin gate oxides: effects of F, H2, N, oxide thickness and injected Si interstitials.” Technical Digest International Electron Devices Meeting, Dec. 1995, pp. 85–88.
Fair RB. Unified model of boron diffusion in thin gate oxides: effects of F, H2, N, oxide thickness and injected Si interstitials. Technical Digest International Electron Devices Meeting. 1995 Dec 1;85–88.
Published In
Technical Digest International Electron Devices Meeting
ISSN
0163-1918
Publication Date
December 1, 1995
Start / End Page
85 / 88