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Haozhe Wang

Assistant Professor of Electrical and Computer Engineering
Electrical and Computer Engineering

Selected Publications


Interfacial Oxidation of Metals on Graphene

Journal Article ACS Applied Nano Materials · January 1, 2024 In this work, we report the graphene-promoted formation of an interfacial oxide layer when certain metals are deposited on graphene. We probe interfacial oxide formation through the observation that several metals, when 10-12 nm in thickness and deposited ... Full text Cite

Isotropic plasma-thermal atomic layer etching of superconducting titanium nitride films using sequential exposures of molecular oxygen and SF6/H2 plasma

Journal Article Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films · December 1, 2023 Microwave loss in superconducting TiN films is attributed to two-level systems in various interfaces arising in part from oxidation and microfabrication-induced damage. Atomic layer etching (ALE) is an emerging subtractive fabrication method which is capab ... Full text Cite

Cascaded compression of size distribution of nanopores in monolayer graphene.

Journal Article Nature · November 2023 Monolayer graphene with nanometre-scale pores, atomically thin thickness and remarkable mechanical properties provides wide-ranging opportunities for applications in ion and molecular separations1, energy storage2 and electronics ... Full text Cite

Isotropic plasma-thermal atomic layer etching of aluminum nitride using SF6plasma and Al(CH3)3

Journal Article Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films · May 1, 2023 We report the isotropic plasma atomic layer etching (ALE) of aluminum nitride using sequential exposures of SF6 plasma and trimethylaluminum [Al(CH3)3]. ALE was observed at temperatures greater than 200 °C, with a maximum etch rate of 1.9 Å/cycle observed ... Full text Cite

Oxidation-resistant metallic films: Surface engineering at the angstrom scale

Journal Article Matter · August 3, 2022 Oxidation-resistant metallic films are of fundamental and practical interest in diverse applications, such as classical and quantum electronics. In a recent paper in Nature, Kim et al. report Cu (111) surfaces which do not oxidize over year timescales owin ... Full text Cite

Frank-van der Merwe growth in bilayer graphene

Journal Article Matter · October 6, 2021 Bilayer graphene has attracted significant interest because of its unique properties, including fascinating electrical behavior when one layer is slightly rotated relative to the other. However, the quality of large-area bilayer graphene is often limited b ... Full text Cite

Toward MXene interconnects

Journal Article Matter · May 5, 2021 Featured Publication Performance challenges as electronics continue to scale down motivate searches for new interconnect materials. In a recent report in Matter, Lipatov and coworkers demonstrate that MXene may be a candidate for interconnects by measuring conductivity and bre ... Full text Cite

Paraffin-enabled graphene transfer.

Journal Article Nature communications · February 2019 The performance and reliability of large-area graphene grown by chemical vapor deposition are often limited by the presence of wrinkles and the transfer-process-induced polymer residue. Here, we report a transfer approach using paraffin as a support layer, ... Full text Cite

Self-Assembled, Ultrahigh Refractive Index Pseudo-Periodic Sn Nanostructures for Broad-Band Infrared Photon Management in Single Layer Graphene

Journal Article ACS Photonics · January 16, 2019 Graphene is a two-dimensional material with intriguing electrical and optical properties for infrared photonic devices. However, single layer graphene (SLG) suffers from a very low optical absorption of ∼1-2% depending on the substrate, which significantly ... Full text Cite

Low-Temperature Copper Bonding Strategy with Graphene Interlayer.

Journal Article ACS nano · March 2018 The reliability of lead-free Cu bonding technology is often limited by high bonding temperature and perpetual growth of intermetallic compounds between Sn solder and Cu substrate. Here, we report a low-bonding-temperature and highly reliable Cu bonding str ... Full text Cite

Interfacial morphology evolution of a novel room-temperature ultrasonic bonding method based on nanocone arrays

Journal Article Applied Surface Science · January 1, 2015 The evolution of interfacial morphology is investigated in joints bonded by a newly developed ambient-temperature ultrasonic bonding process based on Ni nano-cone arrays. This confirmed two types of void at the interface: a Type I void in the concave area ... Full text Cite

IMC growth at the interface of Sn-2.0Ag-2.5Zn solder joints with Cu, Ni, and Ni-W substrates

Journal Article Journal of Electronic Materials · November 1, 2014 Growth of intermetallic compounds (IMC) at the interface of Sn-2.0Ag-2.5Zn solder joints with Cu, Ni, and Ni-W substrates have been investigated. For the Cu substrate, a Cu5Zn8 IMC layer with Ag3Sn particles on top was observed at the interface; this acted ... Full text Cite

Investigation of ultrasonic bonding interface based on Ni micro-nano cones array

Conference Proceedings of the Electronic Packaging Technology Conference, EPTC · October 13, 2014 Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morp ... Full text Cite

Synthesis of hierarchical mushroom-like cobalt nanostructures based on one-step galvanostatic electrochemical deposition

Journal Article CrystEngComm · September 14, 2014 Featured Publication Hierarchical mushroom-like cobalt materials were synthesized by galvanostatic electroplating. The morphology of the product, which can evolve from cone-like to mushroom-like nanostructures, is controllable by changing the deposition parameters. The nanostr ... Full text Cite