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Current Appointments & Affiliations


Recent Publications


Enhanced Thermal Management in Microelectronics Packaging With 2D h‐BN Nanocomposite Underfills

Journal Article Nano Select · February 2025 ABSTRACTThe quest for faster and more densely packed microelectronic circuits has necessitated significant advancements in thermal management and encapsulant manufacturing technologies. This pursuit has driven the developme ... Full text Cite

Transformation of hexagonal boron nitride nanocomposite underfill in microelectronics packaging

Journal Article Polymer Composites · October 10, 2024 AbstractIn recent years, hexagonal boron nitride (h‐BN) has gained attention for its potential applications in thermal management and high‐temperature uses. To evaluate the environmental impact of emp ... Full text Cite
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Recent Grants


Developing platforms for studying the impact of external stresses on multi species biofilms

ResearchPostdoctoral Associate · Awarded by National Institute of General Medical Sciences · 2021 - 2026

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