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Selected Publications


Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy

Conference 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) · May 2017 Full text Cite

Thermal and Viscoelastic Properties of Underfill Using hexagonal Boron Nitride (hBN) Nanofiller

Journal Article International Symposium on Microelectronics · January 1, 2017 AbstractEpon 826 epoxy resin in conjunction with Epikure 3140 curing agent was used in this study to fabricate underfill composites. Nanofiller of 500nm hexagonal boron nitride (hBN) was incorporated in the ... Full text Cite

Graphene nano-, micro- and macro-photonics

Conference 2012 14th International Conference on Transparent Optical Networks (ICTON) · July 2012 Full text Cite