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Selected Publications
Journal Article
Fiber and Integrated Optics
·
March 4, 2022
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Conference
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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May 2017
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Journal Article
International Symposium on Microelectronics
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January 1, 2017
AbstractEpon 826 epoxy resin in conjunction with Epikure 3140 curing agent was used in this study to fabricate underfill composites. Nanofiller of 500nm hexagonal boron nitride (hBN) was incorporated in the ...
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Conference
2012 14th International Conference on Transparent Optical Networks (ICTON)
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July 2012
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