Abbasi, S., & Aravamudhan, S. (2017). Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy. In 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 251–259). IEEE. https://doi.org/10.1109/itherm.2017.7992479

Abbasi, S., and Shyam Aravamudhan. “Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy.” In 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 251–59. IEEE, 2017. https://doi.org/10.1109/itherm.2017.7992479.

Abbasi S, Aravamudhan S. Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy. In: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE; 2017. p. 251–9.

Abbasi, S., and Shyam Aravamudhan. “Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy.” 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, 2017, pp. 251–59. Crossref, doi:10.1109/itherm.2017.7992479.

Abbasi S, Aravamudhan S. Effect of boron nitride (hBN) filler on thermal properties of underfill epoxy. 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE; 2017. p. 251–259.