Thermal and Viscoelastic Properties of Underfill Using hexagonal Boron Nitride (hBN) Nanofiller

Epon 826 epoxy resin in conjunction with Epikure 3140 curing agent was used in this study to fabricate underfill composites. Nanofiller of 500nm hexagonal boron nitride (hBN) was incorporated in the underfill epoxy using ultrasonication technique to alter their thermal and viscoelastic properties. Filler contents ranging from 1% to 5% volume fraction (vol.%) were used to investigate changes in thermal behavior and viscoelasticity of underfill with an increase in filler loading. Thermal analysis has shown an increase in thermal conductivity of the underfill by increasing the filler loading. Using 5% vol.% of 500nm hBN nanofiller a thermal conductivity of 0.32 W/m.K was obtained as compared to neat epoxy with thermal conductivity of about 0.2 W/m.K, showing an enhancement in thermal conductivity of the underfill material. Furthermore, studying viscoelastic properties of fabricated underfills suggested the influence of filler and filler loading on viscoelasticity of underfill.

Duke Scholars

Author Sara Estevez