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Internal stress storage in shape memory polymer nanocomposites

Publication ,  Journal Article
Gall, K; Dunn, ML; Liu, Y; Stefanic, G; Balzar, D
Published in: Applied Physics Letters
July 12, 2004

The storage and release of internal stresses in shape memory polymers reinforced with a dispersion of nanometer-scale SiC particles were examined. A quantitative Rietveld analysis of diffraction peaks was used to measure changes in the lattice parameter of the SiC particles after permenent deformation at 25°C. The nanoparticles store a finite compressive stress, which was almost completely released during heated strain recovery, under 50% compression of the composite material. The true compressive stress-strain response of the nanocomposite material at T d=25°C was also presented.

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Published In

Applied Physics Letters

DOI

ISSN

0003-6951

Publication Date

July 12, 2004

Volume

85

Issue

2

Start / End Page

290 / 292

Related Subject Headings

  • Applied Physics
  • 51 Physical sciences
  • 40 Engineering
  • 10 Technology
  • 09 Engineering
  • 02 Physical Sciences
 

Citation

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Gall, K., Dunn, M. L., Liu, Y., Stefanic, G., & Balzar, D. (2004). Internal stress storage in shape memory polymer nanocomposites. Applied Physics Letters, 85(2), 290–292. https://doi.org/10.1063/1.1769087
Gall, K., M. L. Dunn, Y. Liu, G. Stefanic, and D. Balzar. “Internal stress storage in shape memory polymer nanocomposites.” Applied Physics Letters 85, no. 2 (July 12, 2004): 290–92. https://doi.org/10.1063/1.1769087.
Gall K, Dunn ML, Liu Y, Stefanic G, Balzar D. Internal stress storage in shape memory polymer nanocomposites. Applied Physics Letters. 2004 Jul 12;85(2):290–2.
Gall, K., et al. “Internal stress storage in shape memory polymer nanocomposites.” Applied Physics Letters, vol. 85, no. 2, July 2004, pp. 290–92. Scopus, doi:10.1063/1.1769087.
Gall K, Dunn ML, Liu Y, Stefanic G, Balzar D. Internal stress storage in shape memory polymer nanocomposites. Applied Physics Letters. 2004 Jul 12;85(2):290–292.

Published In

Applied Physics Letters

DOI

ISSN

0003-6951

Publication Date

July 12, 2004

Volume

85

Issue

2

Start / End Page

290 / 292

Related Subject Headings

  • Applied Physics
  • 51 Physical sciences
  • 40 Engineering
  • 10 Technology
  • 09 Engineering
  • 02 Physical Sciences