Thermomechanical behavior and reliability of AU/SI MEMS structures

The magnitude and physics of inelastic behavior of Au/Si microelectromechanical structures at various thermomechanical loading conditions were investigated. Bimorph gold and polysilicon cantilever beams were fabricated by commercial foundry process. The curvature of beam was measured to characterize the structure's shape. Increased separation of grain boundaries was shown with the help of field emission scanning electron microscopy. It was suggested that grain boundary separation, surface evolution and hillocking can have adverse effects on optical, RF and DC electronics applications.

Duke Scholars

Author Ken Gall Thomas Lord Department of Mechanical Engineering and Materia ...