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DynaSprint: Microarchitectural sprints with dynamic utility and thermal management

Publication ,  Conference
Huang, Z; Joao, JA; Rico, A; Hilton, AD; Lee, BC
Published in: Proceedings of the Annual International Symposium on Microarchitecture, MICRO
October 12, 2019

Sprinting is a class of mechanisms that provides a short but significant performance boost while temporarily exceeding the thermal design point. We propose DynaSprint, a software runtime that manages sprints by dynamically predicting utility and modeling thermal headroom. Moreover, we propose a new sprint mechanism for caches, increasing capacity briefly for enhanced performance. For a system that extends last-level cache capacity from 2MB to 4MB per core and can absorb 10J of heat, DynaSprint-guided cache sprints improve performance by 17% on average and by up to 40% over a non-sprinting system. These performance outcomes, within 95% of an oracular policy, are possible because DynaSprint accurately predicts phase behavior and sprint utility.

Duke Scholars

Published In

Proceedings of the Annual International Symposium on Microarchitecture, MICRO

DOI

ISSN

1072-4451

Publication Date

October 12, 2019

Start / End Page

426 / 439
 

Citation

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Huang, Z., Joao, J. A., Rico, A., Hilton, A. D., & Lee, B. C. (2019). DynaSprint: Microarchitectural sprints with dynamic utility and thermal management. In Proceedings of the Annual International Symposium on Microarchitecture, MICRO (pp. 426–439). https://doi.org/10.1145/3352460.3358301
Huang, Z., J. A. Joao, A. Rico, A. D. Hilton, and B. C. Lee. “DynaSprint: Microarchitectural sprints with dynamic utility and thermal management.” In Proceedings of the Annual International Symposium on Microarchitecture, MICRO, 426–39, 2019. https://doi.org/10.1145/3352460.3358301.
Huang Z, Joao JA, Rico A, Hilton AD, Lee BC. DynaSprint: Microarchitectural sprints with dynamic utility and thermal management. In: Proceedings of the Annual International Symposium on Microarchitecture, MICRO. 2019. p. 426–39.
Huang, Z., et al. “DynaSprint: Microarchitectural sprints with dynamic utility and thermal management.” Proceedings of the Annual International Symposium on Microarchitecture, MICRO, 2019, pp. 426–39. Scopus, doi:10.1145/3352460.3358301.
Huang Z, Joao JA, Rico A, Hilton AD, Lee BC. DynaSprint: Microarchitectural sprints with dynamic utility and thermal management. Proceedings of the Annual International Symposium on Microarchitecture, MICRO. 2019. p. 426–439.

Published In

Proceedings of the Annual International Symposium on Microarchitecture, MICRO

DOI

ISSN

1072-4451

Publication Date

October 12, 2019

Start / End Page

426 / 439