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Correlated Bayesian Co-Training for Virtual Metrology

Publication ,  Journal Article
Nguyen, C; Li, X; Blanton, S
Published in: IEEE Transactions on Semiconductor Manufacturing
February 1, 2023

A rising challenge in manufacturing data analysis is training robust regression models using limited labeled data. In this work, we investigate a semi-supervised regression scenario, where a manufacturing process operates on multiple mutually correlated states. We exploit this inter-state correlation to improve regression accuracy by developing a novel co-training method, namely Correlated Bayesian Co-training (CBCT). CBCT adopts a block Sparse Bayesian Learning framework to enhance multiple individual regression models which share the same support. Additionally, CBCT casts a unified prior distribution on both the coefficient magnitude and the inter-state correlation. The model parameters are estimated using maximum-a-posteriori estimation (MAP), while hyper-parameters are estimated using the expectation-maximization (EM) algorithm. Experimental results from two industrial examples shows that CBCT successfully leverages inter-state correlation to reduce the modeling error by up to 79.40%, compared to other conventional approaches. This suggests that CBCT is of great value to multi-state manufacturing applications.

Duke Scholars

Published In

IEEE Transactions on Semiconductor Manufacturing

DOI

EISSN

1558-2345

ISSN

0894-6507

Publication Date

February 1, 2023

Volume

36

Issue

1

Start / End Page

28 / 36

Related Subject Headings

  • Industrial Engineering & Automation
  • 4009 Electronics, sensors and digital hardware
  • 0910 Manufacturing Engineering
  • 0906 Electrical and Electronic Engineering
 

Citation

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MLA
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Nguyen, C., Li, X., & Blanton, S. (2023). Correlated Bayesian Co-Training for Virtual Metrology. IEEE Transactions on Semiconductor Manufacturing, 36(1), 28–36. https://doi.org/10.1109/TSM.2022.3217350
Nguyen, C., X. Li, and S. Blanton. “Correlated Bayesian Co-Training for Virtual Metrology.” IEEE Transactions on Semiconductor Manufacturing 36, no. 1 (February 1, 2023): 28–36. https://doi.org/10.1109/TSM.2022.3217350.
Nguyen C, Li X, Blanton S. Correlated Bayesian Co-Training for Virtual Metrology. IEEE Transactions on Semiconductor Manufacturing. 2023 Feb 1;36(1):28–36.
Nguyen, C., et al. “Correlated Bayesian Co-Training for Virtual Metrology.” IEEE Transactions on Semiconductor Manufacturing, vol. 36, no. 1, Feb. 2023, pp. 28–36. Scopus, doi:10.1109/TSM.2022.3217350.
Nguyen C, Li X, Blanton S. Correlated Bayesian Co-Training for Virtual Metrology. IEEE Transactions on Semiconductor Manufacturing. 2023 Feb 1;36(1):28–36.

Published In

IEEE Transactions on Semiconductor Manufacturing

DOI

EISSN

1558-2345

ISSN

0894-6507

Publication Date

February 1, 2023

Volume

36

Issue

1

Start / End Page

28 / 36

Related Subject Headings

  • Industrial Engineering & Automation
  • 4009 Electronics, sensors and digital hardware
  • 0910 Manufacturing Engineering
  • 0906 Electrical and Electronic Engineering