Modeling boron diffusion in ultrathin nitrided oxide p + Si gate technology
Publication
, Journal Article
Fair, RB
Published in: IEEE Electron Device Letters
June 1, 1997
Based on a network defect model for the diffusion of B in SiO
Duke Scholars
Published In
IEEE Electron Device Letters
DOI
ISSN
0741-3106
Publication Date
June 1, 1997
Volume
18
Issue
6
Start / End Page
244 / 247
Related Subject Headings
- Applied Physics
- 4009 Electronics, sensors and digital hardware
- 0906 Electrical and Electronic Engineering
Citation
APA
Chicago
ICMJE
MLA
NLM
Fair, R. B. (1997). Modeling boron diffusion in ultrathin nitrided oxide p + Si gate technology. IEEE Electron Device Letters, 18(6), 244–247. https://doi.org/10.1109/55.585342
Fair, R. B. “Modeling boron diffusion in ultrathin nitrided oxide p + Si gate technology.” IEEE Electron Device Letters 18, no. 6 (June 1, 1997): 244–47. https://doi.org/10.1109/55.585342.
Fair RB. Modeling boron diffusion in ultrathin nitrided oxide p + Si gate technology. IEEE Electron Device Letters. 1997 Jun 1;18(6):244–7.
Fair, R. B. “Modeling boron diffusion in ultrathin nitrided oxide p + Si gate technology.” IEEE Electron Device Letters, vol. 18, no. 6, June 1997, pp. 244–47. Scopus, doi:10.1109/55.585342.
Fair RB. Modeling boron diffusion in ultrathin nitrided oxide p + Si gate technology. IEEE Electron Device Letters. 1997 Jun 1;18(6):244–247.
Published In
IEEE Electron Device Letters
DOI
ISSN
0741-3106
Publication Date
June 1, 1997
Volume
18
Issue
6
Start / End Page
244 / 247
Related Subject Headings
- Applied Physics
- 4009 Electronics, sensors and digital hardware
- 0906 Electrical and Electronic Engineering