Oxide thickness effect on boron diffusion in thin oxide p+ Si gate technology
Publication
, Journal Article
Fair, RB
Published in: IEEE Electron Device Letters
May 1, 1996
Based on a network defect model for the diffusion of B in SiO
Duke Scholars
Published In
IEEE Electron Device Letters
DOI
ISSN
0741-3106
Publication Date
May 1, 1996
Volume
17
Issue
5
Start / End Page
242 / 243
Related Subject Headings
- Applied Physics
- 4009 Electronics, sensors and digital hardware
- 0906 Electrical and Electronic Engineering
Citation
APA
Chicago
ICMJE
MLA
NLM
Fair, R. B. (1996). Oxide thickness effect on boron diffusion in thin oxide p+ Si gate technology. IEEE Electron Device Letters, 17(5), 242–243. https://doi.org/10.1109/55.491842
Fair, R. B. “Oxide thickness effect on boron diffusion in thin oxide p+ Si gate technology.” IEEE Electron Device Letters 17, no. 5 (May 1, 1996): 242–43. https://doi.org/10.1109/55.491842.
Fair RB. Oxide thickness effect on boron diffusion in thin oxide p+ Si gate technology. IEEE Electron Device Letters. 1996 May 1;17(5):242–3.
Fair, R. B. “Oxide thickness effect on boron diffusion in thin oxide p+ Si gate technology.” IEEE Electron Device Letters, vol. 17, no. 5, May 1996, pp. 242–43. Scopus, doi:10.1109/55.491842.
Fair RB. Oxide thickness effect on boron diffusion in thin oxide p+ Si gate technology. IEEE Electron Device Letters. 1996 May 1;17(5):242–243.
Published In
IEEE Electron Device Letters
DOI
ISSN
0741-3106
Publication Date
May 1, 1996
Volume
17
Issue
5
Start / End Page
242 / 243
Related Subject Headings
- Applied Physics
- 4009 Electronics, sensors and digital hardware
- 0906 Electrical and Electronic Engineering