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Challenges to Manufacturing Submicron, Ultra-Large Scale Integrated Circuits

Publication ,  Journal Article
Fair, RB
Published in: Proceedings of the IEEE
January 1, 1990

The cost of manufacturing submicron, ultra-large-scale integration (ULSI) integrated circuits (ICs) is scaling upwards at least in inverse proportion to the downwards scaling of device feature sizes. These costs are driven by a parameter budget crisis associated with the technological and complexity limits of IC design and fabrication. This budget crisis is defined for technologies associated with patterning, mechanical control, thermal treatments, particulates and contamination, defects, electrical parameters and manufacturing. Competition on the production floor has put manufacturing in the role of a technology driver for setting R&D priorities for silicon ULSI. In this paper these priorities are identified and quantified, and the potential impact of some new research results is discussed. It is pointed out that the R&D agenda to deal with the ULSI manufacturing budget crisis is enormous, and the semiconductor industry cannot perform all of it. Since the time for transferring new developments into production tools and technologies is five to seven years, critical funding decisions need to be made now for ULSI manufacturing science breakthroughs by the turn of the century. © 1990 IEEE

Duke Scholars

Published In

Proceedings of the IEEE

DOI

EISSN

1558-2256

ISSN

0018-9219

Publication Date

January 1, 1990

Volume

78

Issue

11

Start / End Page

1687 / 1705

Related Subject Headings

  • 4009 Electronics, sensors and digital hardware
  • 0906 Electrical and Electronic Engineering
  • 0903 Biomedical Engineering
  • 0801 Artificial Intelligence and Image Processing
 

Citation

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ICMJE
MLA
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Fair, R. B. (1990). Challenges to Manufacturing Submicron, Ultra-Large Scale Integrated Circuits. Proceedings of the IEEE, 78(11), 1687–1705. https://doi.org/10.1109/5.63298
Fair, R. B. “Challenges to Manufacturing Submicron, Ultra-Large Scale Integrated Circuits.” Proceedings of the IEEE 78, no. 11 (January 1, 1990): 1687–1705. https://doi.org/10.1109/5.63298.
Fair RB. Challenges to Manufacturing Submicron, Ultra-Large Scale Integrated Circuits. Proceedings of the IEEE. 1990 Jan 1;78(11):1687–705.
Fair, R. B. “Challenges to Manufacturing Submicron, Ultra-Large Scale Integrated Circuits.” Proceedings of the IEEE, vol. 78, no. 11, Jan. 1990, pp. 1687–705. Scopus, doi:10.1109/5.63298.
Fair RB. Challenges to Manufacturing Submicron, Ultra-Large Scale Integrated Circuits. Proceedings of the IEEE. 1990 Jan 1;78(11):1687–1705.

Published In

Proceedings of the IEEE

DOI

EISSN

1558-2256

ISSN

0018-9219

Publication Date

January 1, 1990

Volume

78

Issue

11

Start / End Page

1687 / 1705

Related Subject Headings

  • 4009 Electronics, sensors and digital hardware
  • 0906 Electrical and Electronic Engineering
  • 0903 Biomedical Engineering
  • 0801 Artificial Intelligence and Image Processing