Alternative substrates for InP and related materials
Publication
, Journal Article
Kuech, TF; Liu, N; Kim, TH; Yi, C; Brown, AS
Published in: Conference Proceedings - International Conference on Indium Phosphide and Related Materials
July 25, 2003
The transfer and separation of device layers or even finished device structures from a III-V substrate allows can lead to higher utilization of bulk wafer and the incorporation of multiple materials onto a single larger wafer. Depending on thethermal budget of the post-bonding process, low-cost, highly thermally conductive yet insulating substrates, such as poly-crystalline AlN, can be used provide a large area low-cost platform that has improved thermal management over the bulk substrate. This technology will be described and the limitations on the choice of bonding materials, process, and thermal history are discussed.
Duke Scholars
Published In
Conference Proceedings - International Conference on Indium Phosphide and Related Materials
ISSN
1092-8669
Publication Date
July 25, 2003
Start / End Page
562
Citation
APA
Chicago
ICMJE
MLA
NLM
Kuech, T. F., Liu, N., Kim, T. H., Yi, C., & Brown, A. S. (2003). Alternative substrates for InP and related materials. Conference Proceedings - International Conference on Indium Phosphide and Related Materials, 562.
Kuech, T. F., N. Liu, T. H. Kim, C. Yi, and A. S. Brown. “Alternative substrates for InP and related materials.” Conference Proceedings - International Conference on Indium Phosphide and Related Materials, July 25, 2003, 562.
Kuech TF, Liu N, Kim TH, Yi C, Brown AS. Alternative substrates for InP and related materials. Conference Proceedings - International Conference on Indium Phosphide and Related Materials. 2003 Jul 25;562.
Kuech, T. F., et al. “Alternative substrates for InP and related materials.” Conference Proceedings - International Conference on Indium Phosphide and Related Materials, July 2003, p. 562.
Kuech TF, Liu N, Kim TH, Yi C, Brown AS. Alternative substrates for InP and related materials. Conference Proceedings - International Conference on Indium Phosphide and Related Materials. 2003 Jul 25;562.
Published In
Conference Proceedings - International Conference on Indium Phosphide and Related Materials
ISSN
1092-8669
Publication Date
July 25, 2003
Start / End Page
562